Patent · US Active

Loudspeaker resin molding component and loudspeaker using the same and electronic device and mobile apparatus using the loudspeaker

US8873793B2 · kind B2 · utility

1Cited by

2References

19Claims

0Family size

Assignee

PANASONIC HOLDINGS CORPORATION · JP

Inventors

Yohei Jin · Somalomo, CM
Yoshimich Kajihara · Somalomo, CM
Toru Fujii · Chiba, JP

Key dates

Filing date	Jul 19, 2013
Grant date	Oct 28, 2014
Priority date	—
Expiry date	Jul 19, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2307/029
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A loudspeaker resin molding component includes resin and bamboo fibers refined to have a microfibril status and carbonized. By this configuration, such a loudspeaker resin molding component can achieve both of a high elastic modulus and a large internal loss.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.