Encapsulated electronics
US8874182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2013 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Jan 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An eye-mountable device includes an electrochemical sensor embedded in a polymeric material configured for mounting to a surface of an eye. The electrochemical sensor includes a working electrode and a reference electrode that reacts with an analyte to generate a sensor measurement related to a concentration of the analyte in a fluid to which the eye-mountable device is exposed. An example assembly process includes: forming a sacrificial layer on a working substrate; forming a first layer of a bio-compatible material on the sacrificial layer; providing an electronics module on the first layer of the bio-compatible material, forming a second layer of the bio-compatible material to cover the electronics module; and annealing the first and second layers of the bio-compatible material together to form an encapsulated structure having the electronics module fully encapsulated by the bio-compatible material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.