Methods, systems, and computer-readable media for simulating interconnects in electronic packaging structures
US8874422B2 · kind B2 · utility
3Cited by
2References
22Claims
0Family size
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Key dates
| Filing date | Jun 28, 2011 |
| Grant date | Oct 28, 2014 |
| Priority date | — |
| Expiry date | Jul 31, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and computer-readable media for simulating an electronic packaging structure are disclosed. The methods include providing an electromagnetic simulation framework for simulating the electronic packaging structure that includes at least two planes and an interconnect transitional component. The framework includes solvers for simulation based on parallel-plate, strip line, and microstrip line modes. The method also includes defining ports of the component based on modes, computing a network function characterizing the properties of the component; and associating ports with solvers of the framework.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.