Method and apparatus to detect wire pathologies near crimped connector
US8875580B2 · kind B2 · utility
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19References
16Claims
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Key dates
| Filing date | Dec 13, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Dec 15, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2626
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for evaluating and/or quantifying damage to wire strands of a wire caused during installation of a crimped wire connector, involves launching an ultrasonic wave having known characteristics into a wire at a location that is either the crimp or is adjacent the crimped wire connector, and detecting changes in the characteristics (e.g., amplitude and/or phase shift) of the wave as it is propagates along a length of the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.