Credential manufacturing device substrate shuttle
US8876110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | May 10, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65H2701/1914
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
One embodiment of a credential manufacturing device comprises a first hopper, a first processing path, a first processing device, a substrate shuttle and a shuttle drive. The first hopper is configured to contain a plurality of card substrates and includes an output port. The first processing device is in the first processing path and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle is positioned between the first hopper and the first processing path and is configured to receive individual card substrates from the output port of the first hopper, transport received card substrates along a shuttle path, and deliver received card substrates to the first processing path. The shuttle drive is configured to drive movement of the substrate shuttle along the shuttle path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.