Microneedle and method of manufacturing microneedle
US8876575B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Oct 11, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.