Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards

US8877074B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Mark Bachman · Irvine, US
• Guann-Pyng Li · Irvine, US

Key dates

• Filing date: Apr 30, 2008
• Grant date: Nov 4, 2014
• Expiry date: Mar 9, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1043
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.