Low application temperature hot melt adhesive
US8877305B2 · kind B2 · utility
1Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jan 30, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1397
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
High temperature performance hot melt adhesives are formulated for application at low temperature, i.e., below 300° F. Hot melt adhesive formed with metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.