Method for assembling heat generating element and heat dissipating element, pressure sensitive element, and power supplying unit
US8877560B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2013 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Jul 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1481
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.