Hot melt adhesive comprising cyanoacrylate curing compounds

US8877868B2 · kind B2 · utility

Assignees

• HENKEL IP & HOLDING GMBH · DE
• Henkel US IP & Holding GmbH · US

Inventors

• Marcus Heemann · Goldkronach, DE
• Charles W. Paul · Madison, US
• Maria Xenidou · Flemington, US
• Maja Schroeder · Ratingen, DE
• Sebastian Kostyra · Monheim, DE
• Marisa Phelan · Roscrea, IE

Key dates

• Filing date: Feb 26, 2013
• Grant date: Nov 4, 2014
• Expiry date: Feb 26, 2033

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J133/18
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl (meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.