Reducing back-reflection in laser micromachining systems
US8878095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2010 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Apr 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0064
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods reduce or prevent back-reflections in a laser processing system. A system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface along a beam path, and a spatial filter. The system further includes a beam expander to expand a diameter of the incident laser beam received through the spatial filter, and a scan lens to focus the expanded incident laser beam at a target location on a work surface. A reflected laser beam from the work surface returns through the scan lens to the beam expander, which reduces a diameter of the reflected beam and increases a divergence angle of the reflected laser beam. The spatial filter blocks a portion of the diverging reflected laser beam from passing through the aperture and returning to the laser beam output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.