Method of depositing organic layers onto a substrate
US8878162B2 · kind B2 · utility
5Cited by
30References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2008 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for depositing one or more organic layers onto a substrate, which includes: transferring the one or more layers from a depositing surface of a stamp to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate, and the use of either or both of the steps of: (i) contacting the polymer with a plasticizer; and (ii) heating the substrate and/or stamp, in order to create favorable conditions for conformal contact and uniform layer transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.