Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting system
US8878212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2011 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A light emitting device includes a substrate, at least one electrode, a first contact layer, a second contact layer, a light emitting structure layer, and an electrode layer. The electrode is disposed through the substrate. The first contact layer is disposed on a top surface of the substrate and electrically connected to the electrode. The second contact layer is disposed on a bottom surface of the substrate and electrically connected to the electrode. The light emitting structure layer is disposed above the substrate at a distance from the substrate and electrically connected to the first contact layer. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The electrode layer is disposed on the light emitting structure layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.