Light emitting module
US8878221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Oct 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.