Integrated circuit resistors with reduced parasitic capacitance
US8878334B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Mar 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/811
Abstract
Integrated circuits that include resistors are provided. An integrated circuit resistor may include a conductive structure disposed over a semiconductor substrate. An oxide layer may be interposed between the conductive structure and a top surface of the semiconductor substrate. A shallow trench isolation structure may be formed in the substrate directly beneath the oxide layer. The shallow trench isolation structure may be formed in a given region in the substrate that is contained within a surrounding n-well and a deep n-well. The given region within which the shallow trench isolation structure is formed may exhibit native substrate dopant concentration levels; the given region is neither an n-well nor a p-well. The surrounding n-well and the deep n-well may be reversed biased to help fully deplete the given region so that parasitic capacitance levels associated with the resistor are minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.