Thin multi-layered structures providing rigidity and conductivity
US8879266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.