Transceiver assembly
US8879267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | May 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L12/6418
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat sink surface facing the thermal interface member and a step extending from the heat sink surface with a module engagement surface. The ribs ride along the step during insertion into and removal from the receptacle of the transceiver module. When the ribs are longitudinally aligned with and engage the step, the module engagement surface is in an elevated position. When the ribs are longitudinally offset from the step, the module engagement surface is in a recessed position and in direct thermal engagement with the thermal interface member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.