Flexible circuit assembly and method thereof
US8879276B2 · kind B2 · utility
64Cited by
12References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2012 |
| Grant date | Nov 4, 2014 |
| Priority date | — |
| Expiry date | Oct 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.