Assembling a radio frequency identification (RFID) tag precursor
US8881373B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Feb 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface may be provided. At least a first portion of the redistribution layer may be electrically connected to the IC through a first opening in the repassivation layer. Furthermore, a substrate having a first antenna terminal may be provided, and a second opening may be formed in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer with an etchant. The first opening and the second opening may be nonoverlapping. The assembly may be attached to the substrate with an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.