Seed layers and process of manufacturing seed layers
US8882077B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2010 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | May 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates seed layers and a process of manufacturing seed layers for casting silicon suitable for use in solar cells or solar modules. The process includes the step of positioning tiles with aligned edges to form seams on a suitable surface, and the step of joining the tiles at the seams to form a seed layer. The step of joining includes heating the tiles to melt at least a portion of the tiles, contacting the tiles at both ends of at least one seam with electrodes, using plasma deposition of amorphous silicon, applying photons to melt a portion of the tiles, and/or layer deposition. Seed layers of this invention include a rectilinear shape of at least about 500 millimeters in width and length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.