Patent · US Active

Laser die light source module with low inductance

US8882310B2 · kind B2 · utility

2Cited by

190References

20Claims

0Family size

Assignee

Microsoft Corporation · US

Inventors

David Mandelboum · Rakefet, IL
Giora Yahav · Haifa, IL
Asaf Pellman · Beer Sheva, IL
Shlomo Felzenshtein · Nesher, IL

Key dates

Filing date	Dec 10, 2012
Grant date	Nov 11, 2014
Priority date	—
Expiry date	Dec 10, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10106
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.