Abrasive slicing tool for electronics industry
US8882868B2 · kind B2 · utility
3Cited by
53References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 30, 2009 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Feb 8, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D5/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.