Conductive metal ink composition and method for forming a conductive pattern
US8883046B2 · kind B2 · utility
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1References
11Claims
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Key dates
| Filing date | Aug 24, 2010 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Dec 24, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0143
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern, and the method of preparing a conductive pattern using the same.The conductive metal ink composition comprises a conductive metal powder; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and a coatability improving polymer and is coated for forming the conductive pattern by the roll printing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.