Method for isolating flexible film from support substrate
US8883053B2 · kind B2 · utility
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13References
15Claims
0Family size
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Key dates
| Filing date | Oct 1, 2009 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Jun 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1116
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.