Patent · US Active

Electroless plating performance of laser direct structuring materials

US8883900B2 · kind B2 · utility

20Cited by

12References

3Claims

0Family size

Assignee

SABIC GLOBAL TECHNOLOGIES B.V. · NL

Inventors

Siguang Jiang · Shanghai, CN
Jiru Meng · Shanghai, CN
Xiangping (David) Zou · Shanghai, CN

Key dates

Filing date	Oct 25, 2011
Grant date	Nov 11, 2014
Priority date	—
Expiry date	Apr 26, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K2201/014
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.