Thick film conductive composition and use thereof
US8884277B2 · kind B2 · utility
8Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2012 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Nov 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a thick film conductive composition comprising metal particles wherein the specific surface area of the silver particles measured by BET according to ISO 9277 is equal to or more than 1.8 m2/g; manganese oxide; glass particles; and an organic vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.