Patent · US Active

Structure for hermetic encapsulation of a device and an electronic component

US8884331B2 · kind B2 · utility

1Cited by

9References

16Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Xavier Baillin · Crolles, FR
Jean-Louis Pornin · Crolles, FR

Key dates

Filing date	Oct 26, 2012
Grant date	Nov 11, 2014
Priority date	—
Expiry date	Oct 26, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

An encapsulation structure including at least one hermetically sealed cavity in which a device, an electronic component produced on a first substrate, and a getter material layer covering the electronic component in order to block the gases capable of being degassed by the electronic component, are enclosed. A top surface of the device is free of contact with the getter material layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.