Hybrid dielectric film for high temperature application
US8884476B2 · kind B2 · utility
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4References
19Claims
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Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Jun 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-temperature insulation assembly for use in high-temperature electrical machines and a method for forming a high-temperature insulation assembly for insulating conducting material in a high-temperature electrical machine. The assembly includes a polymeric film and at least one ceramic coating disposed on the polymeric film. The polymeric film is disposed over conductive wiring or used as a conductor winding insulator for phase separation and slot liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.