Thermal management for electronic device housing
US8885342B2 · kind B2 · utility
33Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2010 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a cage for thermal management and for housing an electronic module. The cage includes top, bottom and side walls joined to form an interior cavity. The side walls form an enclosure having a first panel. A thermally conductive pathway is disposed on the first panel. The enclosure receives an electronic device such as a transceiver module and a heat sink mounted on the first panel. The thermally conductive pathway is disposed between the electronic device and the heat sink so that heat from the electronic device is transmitted via the thermally conductive pathway to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.