Devices and methodologies for handling wafers
US8888085B2 · kind B2 · utility
13Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2010 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jun 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/21
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.