Sculpted fan housing
US8888450B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Inventors
Key dates
| Filing date | Sep 23, 2011 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Feb 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5191
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.