Plating bath and method
US8888984B2 · kind B2 · utility
3Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jan 13, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.