Method for producing silicon waveguides on non-SOI substrate
US8889017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Aug 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02675
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for producing silicon waveguides on non-SOI substrate (non-silicon-on-insulator substrate), and particularly relates to a method for producing silicon waveguides on silicon substrate with a laser. This method includes the following steps: (1) forming a ridge structure with high aspect ratio on a non-SOI substrate; (2) melting and reshaping the ridge structure by laser illumination for forming a structure having broad upper part and narrow lower part; and (3) oxidizing the structure having broad upper part and narrow lower part to form a silicon waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.