Metal wire etchant and method of forming metal wire using the same
US8889032B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
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Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4814
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.