Method of bonding a metal to a substrate
US8889226B2 · kind B2 · utility
9Cited by
10References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Aug 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12444
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a metal to a substrate is disclosed herein. The method involves forming a nano-brush on a surface of the substrate, where the nano-brush includes a plurality of nano-wires extending above the substrate surface. In a molten state, the metal is introduced onto the substrate surface, and the metal surrounds the nano-wires. Upon cooling, the metal surrounding the nano-wires solidifies, and during the solidifying, at least a mechanical interlock is formed between the metal and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.