Systems and methods for non-periodic pulse sequential lateral soldification

US8889569B2 · kind B2 · utility

Assignee

• The Trustees of Columbia University in the City of New York · US

Inventors

• James S. Im · New York, US
• Ui-Jin Chung · New York, US
• Alexander B. Limanov · Nashua, US
• Paul C. Van Der Wilt · New York, US

Key dates

• Filing date: May 13, 2013
• Grant date: Nov 18, 2014
• Expiry date: May 13, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02532
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The disclosed systems and method for non-periodic pulse sequential lateral solidification relate to processing a thin film. The method for processing a thin film, while advancing a thin film in a selected direction, includes irradiating a first region of the thin film with a first laser pulse and a second laser pulse and irradiating a second region of the thin film with a third laser pulse and a fourth laser pulse, wherein the time interval between the first laser pulse and the second laser pulse is less than half the time interval between the first laser pulse and the third laser pulse. In some embodiments, each pulse provides a shaped beam and has a fluence that is sufficient to melt the thin film throughout its thickness to form molten zones that laterally crystallize upon cooling. In some embodiments, the first and second regions are adjacent to each other. In some embodiments, the first and second regions are spaced a distance apart.