Patent · US Active

Thermoplastic molding compounds based on styrene copolymers and polyamides having improved weathering resistance

US8889767B2 · kind B2 · utility

1Cited by

9References

11Claims

0Family size

Assignee

Styrolution GmbH · DE

Inventors

Martin Weber · Maikammer, DE
Marko Blinzler · Mannheim, DE
Christian Schweiger · Wilhelmsfeld, DE
Christoph Schneidereit · Ludwigshafen, DE

Key dates

Filing date	Jan 29, 2010
Grant date	Nov 18, 2014
Priority date	—
Expiry date	Jan 29, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L55/02
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The thermoplastic molding composition comprises

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.