Method for cutting processing target
US8890026B2 · kind B2 · utility
12Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2010 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jan 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby a fracture 17 generated in a thickness direction of the object for separation 10A from a molten processed region 13 acting as a start point reaches a front face 1a of the object 1A continuously without substantially changing its direction. Then, after cutting the objects 1A, 10A, the object 10A is removed from the object 1A, so as to yield chips 19.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.