Bond line heating pad system
US8890033B2 · kind B2 · utility
0Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2013 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Mar 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/014
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat pad assembly for installation and/or removal of a bracket from a structure comprises a heating element. The heat pad assembly may have at least one and, more preferably, a plurality of perforations formed therein. The heating element may be configured to generate heat upon the application of electrical current passing therethrough. The heat pad assembly may be used for temporary installation of a bracket to a mounting surface through the use of an adhesive which is installable between the bracket and the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.