Embedded package security tamper mesh
US8890298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2013 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Jun 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/922
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for embedded tamper mesh protection are provided. The embedded tamper mesh includes a series of protection bond wires surrounding bond wires carrying sensitive signals. The protection bond wires are positioned to be vertically higher than the signal bond wires. The protection wires may be bonded to outer contacts on the substrate while the signal bond wires are bonded to inner contacts, thereby creating a bond wire cage around the signal wires. Methods and systems for providing package level protection are also provided. An exemplary secure package includes a substrate having multiple contacts surrounding a die disposed on an upper surface of the substrate. A mesh die including a series of mesh die pads is coupled to the upper surface of the die. Bond wires are coupled from the mesh die pads to contacts on the substrate thereby creating a bond wire cage surrounding the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.