Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use
US8890312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2007 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Aug 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipation area and improve thermal convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.