TCP-type semiconductor device and method of testing thereof
US8890561B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 3, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Oct 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device includes a base film, a semiconductor chip mounted on the base film, and a plurality of leads formed on the base film, each of the leads including one end coupled to the semiconductor chip and another end being opposite to the one end. The another end of a first one of the leads and the another end of a second one of the leads are located at different positions respectively between the semiconductor chip and a cut line along which the base film is cut.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.