Laminated-type electronic component
US8890646B2 · kind B2 · utility
3Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2013 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Apr 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/0033
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.