Multilayer ceramic electronic component and method of manufacturing the same
US8891226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | May 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.