Apparatus and method for cooling a semiconductor device
US8891240B2 · kind B2 · utility
1Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2011 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Aug 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective first ends disposed within the chamber; wherein, during operation, respective second ends of contact elements contact a surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.