Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US8893513B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | May 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.