Liquid crystal substrate cutting device and cutting method for liquid crystal substrate
US8893598B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Apr 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/541
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.