Wire bonding method in circuit device
US8893953B2 · kind B2 · utility
5Cited by
4References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Mar 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.