Patent · US Active

Integral electrode placement and connection systems

US8894643B2 · kind B2 · utility

21Cited by
87References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 12, 2010
Grant dateNov 25, 2014
Priority date
Expiry dateSep 25, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49155
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Electrodes may also be formed on flexible circuit assemblies integrated within or along the hood. The circuit assemblies may also provide structural support to the hood during delivery and/or deployment. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.