Apparatus and method for etching the surface of a semiconductor substrate
US8894803B2 · kind B2 · utility
2Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2008 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Oct 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for etching the surfaces of semiconductor substrates utilizes a texturing tank which introduces a process fluid through a circulating system. The process fluid is heated to a desired temperature and maintained at a desired concentration prior to entering a processing area where laminar flow is produced to more quickly and uniformly roughen the surface of semiconductor substrates. The texturing tank permits removal of bubbles and eliminates temperature stratification in the processing area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.